Bga Ceramic Ball Technique

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Bga ceramic ball technique. Cbga ceramic bg ceramic ball grid array package drawings bg filter packages by entering lead count or product description into the search box below. Ceramic ball grid array package drawings bg view more csp bga chip scale bc ca chip scale package ball grid array package drawings bc ca view more. The bga is descended from the pin grid array pga which is a package with one face covered or partly covered with pins in a grid pattern which in operation conduct electrical signals between the integrated circuit and the printed circuit board pcb on which it is placed. Package outline material information.

More at wikipedia bga features. In a bga the pins are replaced by pads on the bottom of the package each initially with a tiny solder ball stuck to it. Bga ball grid array a surface bonding encapsulation technique used in integrated circuits. Compared with other packaging technologies bga can accommodate more pins.

In addition to this rather than having the more traditional wire pins for the connections pads with balls of solder are used instead. Advantages are high density low thermal impedance and low inductance pin. The pins of the bga package are arranged in a grid pattern and this gives rise to the name.